What We Offer:

  • • 6-inch wafer fabrication
  • • CMOS and CMOS-compatible process
  • • Prototyping and small-scale production
  • • Wafer processing: thin film, patterning, etching, etc.

Process Capabilities:

Thin film

 
  • • Thermal oxidation (SiO2)
  • • Sputtering (AlCuSi, Ti, TiN)
  • • Low pressure chemical vapor deposition (TEOS oxide, Si3N4, Undoped polysilicon)
  • • Plasma-enhanced chemical vapor deposition (SiO2, Si3N4)
  • • Spin-on-glass film

Photolithography

 
  • • I-line 365nm stepper
  • • EVG 620 NT mask aligner

Etching

 
  • • Reactive ion etching (Polysilicon, SiO2, Si3N4, AlCuSi, Ti, TiN)
  • • Deep reactive ion etching (Si)
  • • Wet etching (SiO2, Si, Al)
  • • HF vapor etching (SiO2)

Ion Implantation

 
  • • Phosphorus ions: P+ and P++
  • • Boron ions: B+ and B++
  • • Arsenic ions: As+
 

Thai Microelectronics Center (TMEC)

51/4 Moo 1, Wangtakien District,
Amphur Muang, Chachoengsao,
Thailand 24000

Google Map

Tel: +66 38 857 100-8,
       +66 62 779 6111

Mobile: +66 92 687 1112

Fax: +66 38 857 175

E-mail: info-tmec@nectec.or.th
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